The Danish Technological Institute is one of few companies in Denmark with a femtosecond laser. The machine is unique in the way that it can process very thin material without causing thermal damages.
New opportunities with “cold” processing
The disadvantage of laser processing is the excretion of heat during the process. This can make it difficult to process very thin products, as they are easily damaged when the surrounding material absorbs the heat - an issue that can be avoided with femtosecond laser processing.
The femtosecond laser releases a laser beam with ultrashort pulses of 150 femtoseconds. This means that the pulse is 45 micrometers, which is smaller than the width of a hair. The ultrashort pulse implies that the energy from the laser does not spread out into the material. Therefore, the process is “cold” which makes it possible to process thin materials without causing thermal damages.
An all-round tool for prototyping
The femtosecond laser is competing with other types of lasers that are usually cheaper because of price and time of processing. But other lasers are not always able to deliver the best quality. In those cases, the femtosecond laser is the right choice. The laser is a good and all-round tool for prototyping. It can process almost all materials such as plastic, metal and ceramics. The process also works on products thinner than a few micrometers, for example thin polymer foils.
What can we help you with?
Besides the femtosecond laser, we can also provide CO2-laser and Excimer-laser work. We are specialized in laser structuring of thin plastic and metal products with a thickness below 1 mm. The laser cutting process will be adapted to your needs; we are able to cut holes between 5-500 µm with high precision.
- Laser cutting of holes and patterns according to your design or specifications.
- Production of functional surfaces by laser micromachining, for example for visual effect or altering surface friction and wettability.
- A variety of materials can be processed - for example polymers such as PET foil, teflon, kapton and rubber, but also ceramics, steel and glass.
- IC chip dicing, where laser cutting is a suitable process in case of thin wafers, irregular cutting patterns and water sensitive designs.
- We are at your service whether you are interessed in a small R&D task, assistance in pilot production, or as a long term reliable partner for full scale production
Feel free to contact us for more information on how our laser laboratories can help you develop your product. Kasper Vestentoft can be reached on +45 7220 3365 or email@example.com