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Innovation test bed for development and production of nanomaterials for lightweight embedded electronics (LEE BED)

Zachary J. Davis

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Visualization of the concept behind the innovation test bed for printed electronics

Innovation test bed for development and production of nanomaterials for lightweight embedded electronics (LEE BED)

Call identifier: NMPB-01-2018

Join our innovation test bed and benefit from some of Europe's leading RTO's within printed electronics. In the test bed you will get access to techno-economic and safety assessment as well as state-of-the-art facilities within nanomaterial production, ink formulation and digital manufacturing.


Concept
The concept of the test bed is depicted in the image above. At the single entry point stakeholders receive a techno/economic and safety assessment, in order to determine the benefits of bringing novel nanomaterials for embedded electronics into their products and production lines. If the assessment is positive, stakeholders have the opportunity to perform a pilot project in phase II. 

Phase II is represented mainly by well-established large RTOs. These RTOs will provide infrastructure to make pilot projects based on phase I modeling and assessments. 

Finally, successful pilot projects will go through phase III and receive a final knowledge transfer, consisting of IPR discussions and final business plan check. 
 

Partners
The innovation test bed already consists of these partners:
A list of the partners in the innovation test bed

Outreach activities
To attract stakeholders, The Danish Technological Institute has performed several outreach activites 

Watch the video below to see an introduction to the concept.

Want to join? Fill out the form, and we will get in touch with you shortly



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The test bed is directed towards the Horizon 2020 NMBP-01-2018 call