Failure Analysis of Critical Materials

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  1. Danish Technological Institute
  2. Business areas
  3. Materials and surface technology
  4. Microanalysis and Imaging
  5. Understand your materials and improve your products
  6. Peel Back the Layers – Non-Destructive 3D visualisation and analysis
  7. Failure Analysis of Critical Materials
Olivia Aalling-Frederiksen

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Clear tube with defect

Failure Analysis of Critical Materials

Micro-CT analysis of materials helps determine extent, location and cause of cracks and breakage

Micro-CT (projection) of broken cableIn pharmaceutical and food production, maintaining the integrity and quality of materials is vital. We offer services using 3D imaging to help you detect and analyze defects in tubing, gloves, and electronic components with thoroughness and accuracy.

We use state-of-the-art Micro-CT technology to provide detailed 3D visualizations of your materials. This technique enables internal examination without the need for physically opening and damaging the material.

We can resolve microscale details and offer a comprehensive view of any defects, including their size and, in some cases, the direction of punctures. 

This capability benefits you by determining where a fault is, allowing you to repair instead of discarding a part, and identifying if it is a single component or the entire machine that has failed.
 

Our Process

  1. Material Submission: Deliver the item you need investigated to us.
  2. 3D Scanning: We use Micro-CT to scan your material.
  3. Detailed Analysis: The scan produces a stack of thousands of images that are used to visualize the material in three dimensions.
  4. Comprehensive Reporting: We provide a detailed report highlighting the microscale defects and other critical findings.

Key Benefits

  • Avoid Waste: Identify cracks and defects early, potentially saving entire batches of materials that need to be kept air-free.
  • Verify Integrity: Ensure the air-tightness of your products by detecting and analyzing cracks or holes.
  • Prevent Future Failures: Understand the cause and extent of breakages to prevent recurrence.
  • Detailed Insights: Determine the size, direction, and depth of punctures or defects to take precise corrective actions.
  • Targeted Repairs: Identify specific faults in electronic components, allowing for precise repairs rather than replacing entire parts or machines.

Crack thickness from micro-CT

Visualization and investigation of crack thickness in tubing using color-coded distance mapping.

Additional Techniques

We often combine results from several separate types of characterization to give you the best possible answer to your needs. Sometimes, a sample is first characterised with Micro-CT and additional information can be added, by doing characterisation with electron microcopy (SEM).

In our labs we perform characterisation with light microscopy, scanning electron microscopy (SEM/EDX, FIB/SEM), infrafred spectrocopy (FT-IR), X-ray diffraction (XRD) and Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS).

Get an overview of our techniques here.

Contact us

Please contact our specialist Olivia Aalling-Frederiksen for more information. She can be reached at ofr@dti.dk or +45 7220 3042.