
Accurate pinhole manufacturing
At the Danish Technological Institute, we specialize in producing pinholes and slits with high precision. These components are essential for critical applications, such as optical detection systems, diagnostic instruments, and leak testing.
Below, we explain the different methods we can use, their compatible materials, and the achievable hole sizes.
Specifications and capabilities
With our focused ion beam scanning electron microscope (FIB-SEM), we can produce pinholes and slits ranging from 2–50 microns in diameter. Our process supports both circular and non-circular shapes, including square holes and slits. These features can be created in thin films of metal (such as steel or titanium) or polymers (such as PET and polyimide), with film thicknesses of up to 20 microns.
FIB-SEM is particularly suited for applications requiring micron-level accuracy in thin materials.
FIB-SEM manufacturing of pinholes and slits
Our manufacturing process ensures that each pinhole meets the highest standards - with a dimensional accuracy of down to ± 1 µm
For larger pinholes or thicker materials (up to 500 microns), our laser laboratory offers additional capabilities. Using specialized laser equipment, we can machine precise holes and patterns in a wide variety of materials, including polymers, ceramics, glass, and rubber. Our lab is equipped with two types of lasers:
- Femtosecond Laser
- Excimer Laser
These technologies allow us to create well-defined holes and patterns with diameters ranging from 5 to 500 micrometers. Materials processed include polymers (e.g., PET, Teflon, Kapton), ceramics, steel, and glass.
Laser micromachining
We specialize in laser structuring of products thinner than a millimeter. The laser cutting process is optimized to your product and your needs, and we are experts in cutting well-defined holes with a diameter of between 5-500 micrometers.
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Laser cutting in plastic materials
Our specialty in laser structuring is plastic products thinner than a millimeter. The laser cutting process is optimized to your product and your needs, and we specialize in cutting well-defined holes with a diameter of between 5-500 micrometers.
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Summary of Capabilities
Technology | Hole Sizes | Materials | Thickness |
---|---|---|---|
FIB-SEM | 2–50 microns | Thin films of metals (steel, titanium) and polymers (PET, Kapton) | Up to 20 microns |
Femtosecond Laser | 5–500 microns | Polymers (PE, PP, Teflon, Kapton), ceramics, steel, glass | Up to 500 microns |
Excimer Laser | 5–500 microns | Polymers (PET, PEEK, Kapton), ceramics, glass, rubber | Up to 500 microns |